EBSD Applications
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Application examples:
Grain size types in rolled copper Nickel tapes for high temperature superconductors
Others:
Indexed diffraction patterns from all crystal systems Diffraction patterns from various materials
If you would like to include your INCACrystal EBSD application on this web site please contact the webmaster.
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EBSD in industry
EBSD is used widely in industrial scientific research in applications concerned with: • Texture measurement in sheet materials in the steel and aluminium industry for quality control applications. • Study of texture in sheet steel and aluminium for improved formability and surface finish. • Study of texture in relation to electrical and magnetic properties. • Influence of grain boundary properties on corrosion, fracture and fatigue in metal manufacturing and nuclear power industries. • Retained ferrite and austenite measurement for steel property enhancement. • Through thickness texture measurements of sputter targets for quality control applications. • Analysis and orientation measurement of second phase particles for materials property enhancement and component lifetime prediction. • Baseline measurement of grain sizes in microelectronic interconnects. • Development of thin film devices. • As a complementary technique to qualify and improve traditional techniques such as optical microscopy and X-ray diffraction.
Other Application areas of EBSD include: • Microscopic studies of texture (preferred orientation measurements) and the relation of microtexture to microstructure. • As a complementary technique to X-ray diffraction for the study of texture on a macroscopic scale. • Studying recrystallisation in metals and alloys. • Study of microstructure, in particular the capability of crystal orientation maps to reveal unambiguously the presence, location and size of grains. • Measurement of grain boundary misorientations and the relation of grain boundary types to phenomena such as segregation, corrosion, precipitation, fatigue and fracture resistance. • Distribution of grain boundary misorientations, twin boundaries and other special boundaries including their effect of material properties. • Texture development, electromigration and reliability in copper and aluminium microelectronic interconnects. • Study of fabric in geological materials. • Thin films, in particular growth of epitaxial layers with applications in solar cells, thin film transistors, non volatile memories, ferroelectric films, and light emitting and laser diodes. • Influence of grain boundary properties on fracture. • High temperature superconductors, including the influence of texture and grain boundary type on superconducting properties. • Measurement and distribution of strain in deformed materials • Orientation of secondary phases and precipitates. • Phase identification, discrimination and fraction determination including analysis of intermetallic materials, carbides and hydrides. • Retained ferrite/austenite measurement in particular at microscopic levels. • Through thickness variations in texture, for example in sputtering targets. • Combination with focussed ion beams for three dimensional analysis of materials. |
