Sample
Preparation for EBSD
Grinding the
Sample
Coarse
Grinding
Grinding can be
achieved in a variety of ways, using a variety of abrasives. Fixed abrasive
surfaces are available using diamond or cubic boron nitride (CBN) abrasives.
The method used to bind the abrasives to the wheel affects the grinding
characteristics, the harder or more rigid the bonding medium, the more
aggressive the grinding action of the surface. Therefore metal bonded fixed
abrasive wheels are the most aggressive grinding surfaces, whereas resin
bonded wheels are less aggressive.
Coarse grit
Silicon Carbide or Alumina abrasives may be used, but the durability or
characteristics of such materials may be inappropriate for certain
materials. Generally, in order to maintain sharp abrasive particles,
grinding papers need frequent changing. Follow the manufacturer’s
recommendations and advice.

Fine
Grinding
Silicon Carbide
(SiC) paper is the traditional method used for fine grinding and is adequate
when used properly. SiC paper blunts quickly and therefore
should be discarded after a short period of grinding in order to maintain
efficient 'stock' removal. Grinding on a surface that has blunt
abrasives causes a great deal of surface damage by smearing, 'burnishing'
and local heating.
Ensure that
sharp abrasives are used and follow the manufacturers' instructions with
regard to grinding speeds, direction, force, times and lubricants used.
Damage injected during grinding may be invisible in the polished surface,
but serve to distort the EBSD result or even completely suppress pattern
formation. Remember that different materials have different
abrasion characteristics. The selection of grinding material and
conditions can therefore be specific to a given sample.
After every
grinding stage it is advisable to inspect the ground surface using a light
microscope in order to ensure that all damage from the previous stage,
whether that be a cutting or grinding stage, is completely removed.
Advance in this manner to the finest abrasive size required, ready for
polishing. Care at this stage will greatly reduce the amount of
polishing required to achieve a good surface.

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