| |
Navigation
links to pages
in EBSD
explained:
Basics of EBSD
EBSD Experiments
Undertaking Experiments
Sample Preparation
Links to this section:
Sample Preparation Camera integration time Background removal Microscope conditions Sample tilt Resolution and accuracy Summary
|
Undertaking EBSD experiments
Sample preparation
EBSD is very sensitive to
crystalline perfection and sample preparation may be needed to remove any
surface damage. A well prepared sample is a prerequisite to obtaining a good
diffraction pattern. Surfaces must be sufficiently smooth to avoid forming
shadows on the diffraction pattern from other parts of the sample. Suitable
techniques for use with EBSD include:
-
For metals and insulators,
mounting in conductive resin, mechanical grinding, diamond polishing and
final polishing with colloidal silica.
-
For metals, mounting in
conductive resin, mechanical grinding, diamond polishing and
electropolishing.
-
Brittle materials such as
ceramics and geological materials can often be fractured to reveal
surfaces immediately suitable for EBSD.
-
Ion milling for materials
which are not amenable to conventional metallography such as zirconium and
zircalloy.
-
Dual focussed ion beam –
electron beam microscopes fitted with EBSD can perform in-situ specimen
preparation for EBSD.
-
Plasma etching for
microelectronic devices.
Charging in non-conductive
samples can be eliminated, as for X-ray microanalysis, by the deposition of
a conducting layer. The deposited layer must be very thin – for example 2 to
3 nm of carbon or gold/palladium– otherwise a diffraction pattern will not
be obtained. It may be necessary to increase the electron accelerating
voltage to penetrate the conducting layer. Charging can be reduced when the
sample is tilted for EBSD experiments and can also be reduced by analysing
the sample in an environmental or low vacuum SEM.
Further information about
sample preparation is given in a separate tutorial.
Next |